Embedded package software "ConX300"
Package software compatible with 300mm communication standards for embedded devices.
The "ConX300" is an embedded package software designed to build a communication interface compliant with the GEM300 standard for equipment. By incorporating this product into 300mm wafer-compatible equipment, it is possible to construct an equipment interface compliant with industry standard specifications such as SECS, HSMS, GEM, and GEM300 without the need for additional hardware. Based on over 20 years of experience in the semiconductor industry, the technical support staff of Mizuho Information & Research Institute will assist in the implementation of the equipment interface through customer training and technical support. 【Features】 ■ Manufactured by PEER Group, Canada ■ Ready-to-use package software ■ No dedicated screen required due to text-based GEM300 configuration management ■ Implementation of state models, object management, and scenarios compliant with each standard by calling functions according to the behavior of the equipment *For more details, please refer to the PDF materials or feel free to contact us.
- Company：みずほ情報総研
- Price：Other
